ISSN 1286-0042
Semiconductors and Devices
In-plane strain states of standard and flip-chip GaN epilayers
Z. Y. Zuo, D. Liu, R. J. Wang, S. B. Qin, H. Liu and X. G. Xu
The European Physical Journal Applied Physics / Volume 54 / Issue 01, 10101
Extraction of equivalent circuit parameters of solar cell: influence of temperature
M. Khalis, Y. Mir, J. Hemine and M. Zazoui
Thermal lensing study based on the heat transfer of diode-pumped Yb3+:Y2SiO5 lasers
R. Niu, C. Lu, D. Wu, X. Fan, C. Liu, J. Liu, L. Zheng, L. Su and J. Xu
Physics of Organic Materials and Devices
Fourier-transform infrared and electrical properties of magnesium phthalocyanine thin films
M.M. El-Nahass, A.A. Atta and E.F.M. El-Zaidia
Thin Films
Angular distributions of flux and energy of the ions emitted during pulsed laser ablation of copper
A. H. Dogar, B. Ilyas, H. Qayyum, S. Ullah and A. Qayyum
Incomplete oxidation in back channel of GaInZnO thin-film transistor grown by rf sputtering
O. Seo, J. Chung and J. Jo
Low temperature Hall effect studies of InSb thin films grown by flash evaporation
C. K. Sumesh, K. D. Patel, G. K. Solanki, V. M. Pathak and R. Srivastav
Growth of single-phase Cu(In, Al)S2 thin films by thermal evaporation
F. Smaïli
Nanomaterials and Nanotechnologies
Purification of single-walled carbon nanotubes
A. Yaya, C. P. Ewels, Ph. Wagner, I. Suarez-Martinez, A. Gebramariam Tekley and L. Rosgaard Jensen
A. Jawad and S.S.Z. Ashraf
Photonics
Influence factors of polarization-independent focusing by octagonal photonic quasicrystal
K. Ren and X. B. Ren
Plasma, Discharges and Processes
Ionic collisions in metallic lattices under transient current pulses
C. D. Papageorgiou and T. E. Raptis
A. Boutaghane, K. Bouhadef, F. Valensi, S. Pellerin and Y. Benkedda
Instrumentation and Metrology
L. Farhat, M. Besbes, A. Bridier and J. Daoud
Surfaces and Interfaces
Propagating optical phonons and their properties in GaN/AlN quantum wells
W. D. Huang, Y. J. Ren, J. F. Yan, Q. Wu and S. H. Zhang
Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate
A. M. Erer, E. Candan, M. H. Güven and Y. Turen